Since this is a translation of foreign articles, there may be mistranslations.
https://hothardware.com/news/sony-ps6-cooling-patent
Sony Researching New Heat Pipe Technology in PlayStation 6 Cooling Patent
Sony has publicly released a new international patent application that details an improved cooling system for future electronic devices. While the PlayStation 6 name isn't directly mentioned in the document, it's clear that the technology being described is of the type that could be applied to a next-generation console. Tech4Gamers was the first to highlight this patent, but I believe they drew conclusions that the document doesn't support.
The patent focuses entirely on redesigning a heat pipe assembly designed to maintain cooling performance regardless of whether the device is placed horizontally or vertically. Rather than introducing a completely new cooling principle, Sony appears to be aiming to improve the way the working fluid inside the heat pipes circulates between the evaporator and condenser sections. This design includes specially shaped pipe sections that help ensure the condensed fluid returns more consistently to the heat source, minimizing the impact of gravity when the console's orientation changes.
In simpler terms, Sony is trying to create a cooling system that is less sensitive to how the console is positioned. This is particularly relevant for devices like the PlayStation 5, which is explicitly designed to be used in both horizontal and vertical orientations. While some repair technicians have reported reliability issues with liquid metal leaking from consoles with compromised seals, Sony officially supports both horizontal and vertical placements.
The patent's diagrams show the PlayStation 5.
From there, Tech4Gamers' conclusion that Sony might abandon the liquid metal thermal interface used in the PlayStation 5 for the PlayStation 6 is more speculative. While it's certainly a possibility and even makes some sense, it doesn't appear to be supported by what the patent describes.
Throughout the document, the focus is on the structure and geometry of the heat pipes themselves – the working fluid, internal channels, and thermal properties of the cooling assembly. It doesn't specifically describe the thermal interface material (TIM) used between the processor package and the cooler.
These are separate components in a cooling system. A future console could easily adopt this improved heat pipe design while continuing to use liquid metal TIM, or it could opt for conventional thermal compound or an entirely different interface material – none of these options contradict what is stated in the patent.
Patent applications are often written broadly, so it's always wise to be cautious about drawing hasty conclusions about product launches based on their content. If you can read Japanese, Sony's latest application offers a fascinating glimpse into how the company is envisioning next-generation cooling solutions for hardware that could function reliably in both horizontal and vertical orientations for years to come.
Whether this ultimately leads to the PlayStation 6, and whether Sony will stick with liquid metal for its next-generation "Orion" system, are questions that the patent itself cannot answer.
https://patents.google.com/patent/WO2025023130A1/ja?oq=JPWO2025023130
▶ Source: https://hothardware.com/news/sony-ps6-cooling-patent
▶ Source: https://patents.google.com/patent/WO2025023130A1/ja?oq=JPWO2025023130
