TSMC, mass production of 2-nanometer chips vs Samsung Electronics, 'yield improvement' fierce pursuit

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TSMC, 2nm ramp-up this year…Next-generation process preparation also smooth sailing

The industry sees that TSMC's 2nm process has secured stable yield from the initial mass production. There are even claims in Taiwan that the yield of the process is over 80%.

Thanks to this, TSMC is expected to dominate the cutting-edge foundry market again this year, following last year. As of the fourth quarter of last year, the share of the 3nm process in TSMC's total revenue reached 28%, a record high.


Samsung Electronics, chasing after with improved yield in 2nm process

Combining stories from inside and outside Samsung Electronics, the wafer-based yield of the process is estimated to be around 50%. This is a significant improvement compared to the mid-30% range seen in the first half of last year. Unlike its predecessor (Exynos 2500), there were no fatal defect issues during the initial mass production phase.


Success or failure of SF2P process is key…"Promotion instructions given to partners"

SF2P has improved performance by 12%, power efficiency by 25%, and reduced area by 8% compared to SF2.

Another semiconductor industry official said, "Samsung Electronics has been pouring its heart into developing the next-generation SF2P process based on the SF2 process, and completed the basic process design kit (PDK) in the first half of last year. Recently, it is known that they have also instructed DSPs (Design Solution Partners) to actively promote SF2P instead of SF2 to customers."

Potential customers are also paying attention to the success of SF2P. This is because SF2P will be responsible for mass production of not only Samsung Electronics' next-generation mobile AP 'Exynos 2700', but also Tesla's AI semiconductors.


▶ Source: https://zdnet.co.kr/view/?no=20260115153150

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