According to foreign media and industry reports on the 26th, Samsung Electronics has reportedly passed the final quality verification for HBM4 conducted by NVIDIA and AMD. Accordingly, Samsung Electronics is said to have begun full-scale production preparations with the goal of full shipment starting next month.
In particular, this HBM4 is reportedly implementing a transmission speed of 11.7Gb (gigabits) per second, exceeding the 10Gb/s specification required by NVIDIA. The product is expected to be mounted as core memory in NVIDIA's next-generation AI accelerator 'Rubin' and AMD 'MI450', which are expected to be released in the second half of this year.
Samsung Electronics actively applied advanced manufacturing processes and design technologies to implement this performance. The basic memory die of HBM4 uses 10-nanometer 6th generation (1c) DRAM, and the logic die, which handles chip control and computation, is reportedly using a 4-nanometer process several generations ahead of competitors.
▶ Source: https://m.kbench.com/?q=node/275582
